DSX2000

DSX2000 Specification:
Head
Optical System Optical system   : Telecentric optical system    
Optical zoom ratio   : From 1X - 10X    
Optical zoom magnification method   : Motorized    
Calibration   : Automatic    
Nosepiece   : Motorized revolving nosepiece    
Number of objectives that can be attached   : Up to 4 high resolution objectives    
Accuracy and repeatability (XY-plane) Accuracy : ±3%    
Repeatability 3 σn-1 : 2%    
Repeatability (Z-axis) Repeatability σn-1 : 1 µm    
Camera Image sensor   : 1.1-inch 12.37-megapixel color CMOS image sensor, global shutter  
Cooling   : Peltier cooling    
Frame rate   : 60 fps (maximum)    
Ultra (Pixel shift mode)   : 6000 x 6000 (1:1), 8192 x 6000 (4:3)    
Super high (3CMOS mode)   : 3000 x 3000 (1:1), 4096 x 3000 (4:3)    
Super high   : 3000 x 3000 (1:1), 4096 x 3000 (4:3)    
4K mode   : 3840 x 2160 (16:9)    
High   : 1500 x 1500 (1:1), 2048 x 1500 (4:3)    
High (Binning 2 x 2)   : 1500 x 1500 (1:1), 2048 x 1500 (4:3)    
Full HD mode   : 1920 x 1080 (16:9)    
Illumination Color light source   : LED    
Lifetime   : 60000 hours (design value)    
Observation Brightfield (BF)   : Available    
Oblique (OBQ)   : Available    
Darkfield (DF)   : Available, LED ring divided into 4 divisions    
MIX (Brightfieldd + Darkfield)   : Available, simultaneous observation of BF + DF    
Polarization (PO)   : Available    
Differential Interference Contrast (DIC)   : Available    
Shaded Relief (SR)   : Available    
Mechanical aperture for contrast settings   : Available    
Mechanical aperture for depth of focus   : Available    
Focus Focusing   : Motorized    
Stroke   : 75 mm (Motorized)    
           
Objective Lens
Objective Lens Type DSX10-XLOB UIS2    
Maximum sample height : 71 mm : 101 mm    
Maximum sample height (Free angle observation) : 50 mm : 50 mm    
Parfocal distance : 75 mm : 45 mm    
Total magnification : 43.8X - 5845X : 26.1X - 7307X    
Actual FOV : 8700 x 6300 µm - 64.9 x 47.6 µm : 14500 x 10700 µm - 51.9 x 38 µm    
           
Stage
Stage Type DSX20-TMTS DSX20-RMTS DSX20-LMTS U-SIC4R
XY-stage: Motorized / Manual : Motorized : Motorized : Motorized : Manual
XY-stroke : 100 x 100 mm : Stroke priority mode: 100 x 100 mm
  Rotation priority mode: 50 x 50 mm
: 200 x 100 mm : 100 x 105 mm
Transmitted Lighting : Integrated (PO, DF, BF, OBQ mode optional : Not available : Not available : Not available
Rotation angle : Not available : Stroke priority mode: ±20°
  Rotation priority mode: ±90°
: Not available : Not available
Display rotation angle : Not available : GUI : Not available : Not available
Maximum load capacity : 5 kg (11 lbs) : 5 kg (11 lbs) : 5 kg (11 lbs) : 1 kg (2.2 lbs)
           
Frame
Frame Type DSX20-UF DSX20-TF    
Z-axis stroke : 50 mm (Manual) : 50 mm (Manual)    
Tilt observation : Not available : ±90°    
Tilt angle display : Not available : GUI    
Tilt angle method : Not available : Manual, Fix/release handle    
           
Display
Display Screen size : 27 inch / 32 inch      
  Resolution : Full HD: 1920 x 1080
  4K: 3840 x 2160
     
           
System Total
System Total Type Upright frame system Tile frame system    
System Total Weight (Frame, head, motorized stage, display, and console) : 54.7 kg (120 lbs) : 51.7 kg (113 lbs)    
  Power consumption : 100 - 120 V / 220 - 240 V
  1.1/0.54 A, 50/60 Hz
: 100 - 120 V / 220 - 240 V
  1.1/0.54 A, 50/60 Hz
   
           
Software
PreCiV DSX : Included: device control, video recording, time-lapse imaging, large panorama acquisition, extended focus imaging, 3D image acquisition, Z-stack acquisition, position list navigation, best image function, extended 2D measurements, 3D measurements, reporting tools, neural network processing, macro recorder    
Operating system : Windows 11-64 bit        
Network connectivity : Compatible with most popular antiviruses, Windows security updates allowed, images can be saved directly to OneDrive.    
Reporting application : Microsoft 365, Office 2021        
Optional software Count and Measure, Neural Network Training, Materials Solutions (Grain Size, Cast Iron, Phase Analysis, Porosity, Particle Size Distribution, Non-Metallic Inclusions, Layer Thickness, Coating Thickness)    
Customization : Included: customizable user interface for predefined workflow creation
  Optional: wafer navigation, automated analysis on specific samples